The Diamond Segment is designed for HTC-compatible grinding machines. It features two large elliptical segments, offering increased contact area and smoother operation during floor grinding tasks.
With its medium bond matrix, this segment is ideal for medium to hard concrete floors, balancing aggressive material removal with surface refinement.
Key Features:
Elliptical Segment Design: Unique oval shape provides stable contact with the floor, minimizing scratch patterns and vibration.
High Diamond Concentration: Ensures consistent grinding speed and extended tool life.
HTC System Compatible: Quick and easy installation on HTC platform grinders.
Dual Grit Options:
#30 Grit: Ideal for aggressive grinding and coating removal
#60 Grit: Suitable for intermediate grinding and surface smoothing
Grit Size | Usage Purpose |
---|
#30 | Removal of coatings, epoxy, paint; rough surface leveling |
#60 | Scratch refinement, preparing for polishing or resin pads |
Surface Types:
Medium to hard concrete
Terrazzo
Cement screeds
Light epoxy flooring (depending on grit)
Machine Compatibility
HTC Floor Grinders (with standard segment holders)
Examples include: HTC 500, HTC 650, HTC DURATIQ series, and other HTC-compatible heads