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The CD1 Series Diamond Grinding Segment is designed for versatile floor preparation applications, especially suitable for medium to fine grinding stages, also referred to as Half Floor (HF) grinding. It provides effective material removal while ensuring a smoother surface finish, making it ideal for jobs transitioning between coarse grinding and polishing.
 
Key Features:
  • HF Grit (Half Floor): Targets mid-stage surface refinement, reducing scratches left by lower grits.
  • Dual Segment Design: Combination of curved and rectangular segments ensures consistent grinding pressure and smoother operation.
  • Durable Performance: High diamond content and quality bond extend lifespan and grinding consistency.
  • Medium Bond Matrix: Suited for grinding medium to hard concrete floors.
  • Q-lock Quick Mount: Allows fast replacement of segments, minimizing downtime.
 
Applications by Grit Size
Grit SizeRecommended Use
20/25Aggressive grinding, epoxy & coating removal
30/40Surface leveling, initial smoothing
70/80Intermediate smoothing, scratch refinement
120/150Fine grinding, pre-polishing preparation
 
Suitable Surfaces:
  • Medium to hard concrete floors
  • Cementitious toppings
  • Terrazzo
  • Light epoxy residues
 
Machine Compatibility:
  • HRC 550E
  • TITAN 550
    (Ensure the machine supports Q-lock segment attachment)
 
Use Scenario
Ideal for contractors or flooring professionals working on:
  • Commercial floor refinishing
  • Warehouse polishing prep
  • Smooth transition between coarse grinding and polishing

Diamond Grinding Segment – CD1 Series

Quantity
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